Simulating Micro-Loading Effects using Advanced Etching

clex20.in : Simulating Micro-Loading Effects using Advanced Etching

Requires: CLEVER

Micro-loading etching effects describe the phenomenon whereby the effective material etch rate depends on the hole size of the pattern masking layer.

This can be simulated using the advanced etching module in Victory Process. Once the structure is created, it is loaded into Clever to simulate back end parasitics.

The etch machine characteristics are described by the Fux, Topography and EtchDepoProperties statements. Once the etch machine has been described, the wafer is loaded into this virtual etch machine and is etched for 4 minutes. The created trench structures are then filled with aluminum.

For ease of observation of the micro-loading effects, a 2D cut line of the 3D structure is created and plotted, where it can be clearly seen that the depth of each trench is dependent on the width of the trench.

To load and run this example, select the Load button in DeckBuild > Examples. This will copy the input file and any support files to your current working directory. Select the Run button in DeckBuild to execute the example.