Contents:

• Introduction
• Key benefits
• Application examples
• Multi-level interconnect
• Metal step coverage after reflow
• Inter-metal dielectric void formation
• Chemical mechanical polish
• Microloading effect
• Elite models
• Interaction of string and gridding algorithms
• Complex trench formation example
• Patterned structure
• Spacer structure
• LOCOS structure
• Grid after DevEdit
• After selecting etching of nitride plug
• Structure after trench etching
• Structure after trench doping
• Structure after polysilicon removal
• Structure after trench reoxidation
• Structure after trench filling
• Structure after oxide reflow
• Structure after final planarization
• Conclusion

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