Contents:

• Introduction
• Key benefits
• Key applications
• Typical lithography process flow
• Complete photolithography process
  • Resist deposition
  • Mask setup
  • Optical system definition
  • Exposure
  • Post exposure bake
  • Develop resist
  • Operation and resist removal
• Process analysis capabilities
  • Exposure dose effect
  • Optical proximity correction (OPC)
  • Imaging analysis and optimization
  • Multi-parameter process control
  • Phase shifted mask lithography
• Summary

Download full presentation (2.7Mb pdf - 34 pages)