A SPAYN Analysis of Circuit Performance Data Obtained Using the Virtual Wafer Fab
Introduction
In previous Simulation Standard articles it has
been shown that UTMOST can be employed within the Virtual
Wafer Fab (VWF) environment to extract circuit simulator device
(SPICE) model parameter sets from data generated as a result of
process and device simulations. UTMOST is used in batch mode,
or more correctly in command-line mode, under DeckBuild to achieve
this functionality. Now it is possible to run the SmartSpice
circuit simulator under DeckBuild in the VWF framework.
Command-line SmartSpice can be activated automatically during
a VWF experiment and SmartSpice can also communicate
successfully with a VWF database. This means that each of
the process simulation, device simulation, parameter extraction,
and circuit simulation tasks can be automatically accomplished during
a VWF sensitivity, design-of-experiments, or Monte Carlo
experiment. The details and logistics associated with the inclusion
of SmartSpice simulations under VWF will be discussed
in a future process and device simulation issue of the Simulation
Standard. In this article we will describe a simple experiment which
will demonstrate this new and extremely important VWF feature.
The data which was produced in this VWF experiment will be
analyzed here using SPAYN. Simple circuit performance macro
models or behavioral models will be derived directly by SPAYN
with the data provided by the VWF. Such macro models are
valuable assets in situations where circuit design optimization
or centering is required as they eliminate the need for time-consuming
circuit simulations [2]. Circuit performance macro models using
the actual process input variables as the predictors rather than
SPICE model parameters are also very useful in process optimization
or process centering applications. Costly process simulation and
circuit simulation times can be vastly decreased using these macro
models.
Experimental Description
The methodology by which so-called process corner
SPICE models can be extracted using the VWF was described
in a previous Simulation Standard article [1] entitled "Statistical
Parameter Analysis for a Process Under Development Using SPAYN".
This experiment involved the automated use of process simulation,
device simulation, and parameter extraction tools. A Monte Carlo
experiment was constructed in which process and mask parameters
were allowed to vary randomly according to Gaussian distributions
with specified means and standard deviations. Among the process
and mask variables targeted for analysis were the P-well implant
dose, the N-well implant dose, the gate oxidation pressure, the
threshold voltage adjust implant dose, the polysilicon gate length,
and the doping in the lightly doped N-type drain and source regions
for a 0.6µm CMOS process. The main object of the experiment
was to derive a system of equations which related the variations
in certain process input parameters to variations in extracted SPICE
BSIM3 parameters. This system of equations was derived using SPAYN.
SPAYN was also used to construct the process corner models and
to activate circuit simulations so that worst-case circuit performances
could be identified. The circuit which was utilized was a simple
CMOS inverter.
In this experiment the circuit simulations and
the extraction of the circuit performance parameters were performed
within the VWF rather than by SPAYN. Thus, the final
VWF worksheet contained process input variables, device performance
parameters (VTH, Beta, etc.), NMOS and PMOS BSIM3 model parameters,
and circuit performance parameters. This data can be analyzed by
the VWF, or exported to SPAYN for a more detailed
analysis as we will do in this example. Circuit performance macro
models were prepared using the Regression Analysis feature of SPAYN.
The circuit under analysis in this example was
a simple CMOS inverter and the SmartSpice input file which
was prepared for use in DeckBuild is shown in Figure 1. DeckBuild
is Silvaco's interactive graphical run-time environment for the
development of process simulation (ATHENA), device simulation
(ATLAS), UTMOST command-line, and now SmartSpice
command-line input decks. It consists of a window for input deck
creation and editing, a window for product output control, and a
set of popups for each product that provide full language and run-time
support. Figure 2 shows a DeckBuild screen where the SmartSpice
commands are loaded.
Figure 1. The SmartSpice commands
used by DeckBuild for the analysis of the CMOS inverter.

Figure 2. The DeckBuild window
showing some of the commands
related to the SmartSpice simulation under investigation.
The commands which appear in Figure 1 consist of
the initialization command for SmartSpice (go SmartSpice),
the .option and netlist statements for the CMOS inverter, the .dc
and .save SmartSpice statements, the circuit .measure statements,
the NMOS and PMOS model cards, and the DeckBuild solve and
extract commands enabling the measured circuit performances to be
stored in the VWF. The SmartSpice .measure statements are
configured to measure the inverter trip (trigger) voltage, trip
current, and small-signal gain. The .model statements make references
to BSIM3 NMOS and PMOS parameters previously extracted by command-line
UTMOST, and stored in the VWF database, for the process
"split" in question. Almost 100 process splits were performed in
this experiment.
Analysis of Results Using SPAYN
The process, SPICE model, and circuit performance
parameters were imported into SPAYN. Histograms of the extracted
device performances appear in Figure 3. An analysis of the entire
parametric correlation matrix proved that while the inverter trip
voltage and current were highly correlated to certain SPICE parameters,
the correlations with the process parameters were significantly
weaker. The inverter gain was not strongly correlated to any one
process or SPICE parameter. Figure 4 shows some scatter plots showing
the relationships between the inverter trip voltage and current
to some important SPICE BSIM3 parameters.


Figure 3. Histograms of the extracted
CMOS inverter circuit parameters.

Figure 4. Selected scatter plots
showing the extracted CMOS inverter
performance parameters and some SPICE parameters.
A PCA analysis of the parametric data exposed the
PMOS K1, the NMOS UO,the PMOS VTH0, and the PMOS VSAT parameters
as being the important independent or dominant BSIM3 parameters.
This importance is based on the amount of the variability of the
other NMOS and PMOS model parameters which can be predicted as a
function of these dominant parameters. Attempts were then made to
derive so-called macro models for the circuit performances under
analysis using the SPAYN Regression facility and the dominant
SPICE parameters derived i.e.
Circuit Performance = Z = F( K1_P, UO_N, VTH0_P, VSAT_P
)
Table 1 shows the R-squared (R2) values associated
with fitting models of varying degrees of complexity to the inverter
circuit characteristics. The predictor variables were the four dominant
parameters identified above. Also tabulated are the average percentage
errors associated with the derived estimates for the circuit parameters.
Regression Model
Comment |
VTRIP |
ITRIP |
GAIN |
| R2 |
Error |
R2 |
Error |
R2 |
Error |
| Linear Terms only |
0.85 |
0.6% |
0.93 |
2.4% |
0.08 |
15.1% |
| + XY Interaction Terms |
0.87 |
0.6% |
0.95 |
2.0% |
0.15 |
14.3% |
| + Quadratic Terms |
0.88 |
0.5% |
0.96 |
1.8% |
0.19 |
14.0% |
| + XYZ Interaction Terms |
0.90 |
0.5% |
0.97 |
1.6% |
0.27 |
13.4% |
| + XY2 Interaction Terms |
0.91 |
0.5% |
0.98 |
1.3% |
0.43 |
11.8% |
| + Cubic Terms |
0.93 |
0.4% |
0.98 |
1.3% |
0.47 |
11.4% |
Table 1. Regression model information
where four dominant SPICE parameters are used.
Figure 5 shows scatter plots of the macro model
estimates of the three circuit performances versus the actual circuit
performances. In these plots the regression model includes all terms
up to and including the cubic terms. The prediction of the trip
voltages and currents are adequate but the prediction of the small-signal
gain is not so good with an R2 value of less than 0.5. This was
probably due to the need for extra parameters in the dominant parameter
predictor set, particularly those affecting the determination of
device output conductance (gds) and transconductance (gm). The small-signal
CMOS inverter gain is very dependent on these device conductances.

Figure 5. Scatter plots of modeled
(SPICE parameter regression model)
and actual (SmartSpice simulations) circuit performance parameters.
The process quantities which were varied as part
of the VWF experiment were also stored in the SPAYN database.
These variables were the pwell_dose, nwell_dose, gateox_press, vtadj_dose,
poly_cd, and NLDD_dose parameters. It was decided to create circuit
macro models in terms of these quantities also i.e.
Circuit Performance = Z = F
(( pwell_dose, nwell_dose,
gateox_press, vtadj_dose,
poly_cd, NLDD_dose )
Table 2 shows the R-squared (R2) values associated
with fitting models of varying degrees of complexity to the inverter
circuit characteristics. The predictor variables were the six process
parameters mentioned above. Also tabulated are the average percentage
errors associated with the derived estimates for the circuit parameters.
Regression Model
Comment |
VTRIP |
ITRIP |
GAIN |
| R2 |
Error |
R2 |
Error |
R2 |
Error |
| Linear Terms only |
0.90 |
0.5% |
0.99 |
1.1% |
- |
- |
| + XY Interaction Terms |
0.92 |
0.4% |
0.99 |
0.8% |
- |
- |
| + Quadratic Terms |
0.93 |
0.4% |
0.99 |
0.7% |
- |
- |
| + XYZ Interaction Terms |
0.96 |
0.3% |
1.00 |
0.6% |
0.61 |
9.9% |
| + XY2 Interaction Terms |
0.98 |
0.% |
1.00 |
0.3% |
0.92 |
4.4% |
| + Cubic Terms |
0.99 |
0.2% |
1.00 |
0.2% |
0.92 |
3.5% |
Table 2. Regression model information
where six process parameters are used.
Figure 6 shows scatter plots of the process parameter
based macromodel estimates for the three circuit performances versus
the actual circuit performances. In these plots the regression model
includes all terms up to and including the cubic terms. The prediction
of the trip voltages and currents are adequate, even in the case
of the simple linear models with no interaction terms. The prediction
of the small-signal gain requires the full cubic model in order
to achieve the required accuracy. In this example the process parameter
regression models using six predictors were more accurate than the
SPICE parameter regression models employing only four terms.


Figure 6. Scatter plots of modeled
(process parameter regression model)
and actual (SmartSpice simulations) circuit performance parameters.
Conclusions
It is now possible to perform SmartSpice
circuit simulations, and extract circuit performance parameters,
during a VWF experiment. Using this new capability a SPAYN
database consisting of process, SPICE model, and circuit performance
parameters was constructed. SPAYN was then used to prepare
two different sets of macro models or behavioral models for a simple
CMOS circuit. The two model sets differed in the choice of the predictor
variables. The first used a subset of the SPICE model parameters
and the second used the process variables which were varied during
the initial VWF experiment. Use was made of the SPAYN
PCA facility to identify the independent subset of dominate SPICE
model parameters, while the SPAYN regression facility was
used to construct and evaluate the macro models. Using such circuit
performance macro models in place of multiple circuit simulations
drastically reduces analysis times during circuit performance optimization
or circuit performance centering experiments. These macro models
are also beneficial in more wide-ranging process optimization or
process centering applications where they serve to reduce the amount
of process simulation, device simulation, and circuit simulations
required.
References
- Simulation Standard, Vol.6, Number 5, May 1995.
- T-K Yu et al., "Statistical Performance Modeling and Parametric Yield Estimation of MOS VLSI,"
IEEE Transactions on Computer-Aided Design, Vol. CAD-6, No.6, Nov. 1987.
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