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VICTORY Stress:

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Manual

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90 Day

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Presentations

3D Stress Simulation

Stress Simulation for FinFET Devices
2.9MB

VICTORY Stress and its Competitors

ANSYS Mechanical, ANSYS Multiphysics, COMSOL Structural Mechanics, COMSOL MEMS, Synopsys Sentaurus Process, T_SUPREMIV (SUPREM4)

VICTORY Stress is a generic 3D stress simulator designed to calculate stresses and mobility enhancement factors for any 3D structure and is a suitable replacement for ANSYS Mechanical and Multiphysics modules, COMSOL Structural Mechanics and MEMS module, Synopsys Sentaurus Process, T_SUPREMIV (SUPREM4). VICTORY Stress provides the following key features:

• Layout driven stress analysis
• Comprehensive material stress models, including the dependence of elasticity coefficients on crystal orientation.
• Generic 3D anisotropic stress simulation for crystalline materials suitable for variety of stress analysis such as:-
  • Strained PMOS, compressive capping layers
  • Mobility enhancements in FinFET channels
  • Stress/strain engineering for MOSFETs, FETs, etc.
• Stress analysis can be performed over full device structure, accounting for all isotropic and anisotropic properties of the materials, boundaries and initial conditions
• Simulation of thermal mismatch between materials, stress from materials mismatch
• Estimate mobility enhancement factors
• Account for intrinsic stress in deposited material layers
• Hydrostatic stress model for capping layers, stress memorization effects, stressors and stress liners
• “Design of Experiments” with VWF can be used to analyze stress dependence on process parameters such as gate length or thickness variations

Synopsys Sentaurus Process, T-SUPREMIV (SUPREM4), ANSYS and COMSOL are trademarks of their respective owners.